Photonic Integrated Circuits, Sensors and NETworks - PIXNET Erasmus Mundus Joint Master Degree

The Photonic Integrated Circuits, Sensors and NETworks (PIXNET) Erasmus Mundus Joint Master Degree is a two-year programme (120 ECTS) aimed at training talented students in the design, creation and assessment of innovative integrated devices based on photonic technologies. The set of learning outcomes include the theoretical design of system/network devices, the design and simulation of a photonic integrated circuit, fabrication in a clean room facility and the packaging and final testing of the prototypes.

PIXNET intends to be an interdisciplinary, multi-national initiative, training young telecommunication and electrical engineers to investigate the adoption of Photonic Integrated Circuit (PIC) as the central element in the evolution of information and communication devices (e.g. Data Centers, mobile terminals, etc.).

PIXNET offer is very valuable for prospective new students, who will enjoy an extremely rich teaching programme, comprising traditional classes, experience in clean-room facilities and interaction with a very wide choice of associated partners.

PIXNET encompasses a wide range of topics and expertise related to the development of highly-skilled “photonic engineers for communication and sensing”. At the end of the learning activities, students will have mastered the following areas:Optical communication,Optical network architectures,Optical components, Optical signal processing and Photonic integration technologies.

 They will have acquired advanced optical networking skills and will be fully able to plan, design, manage and support photonic device technologies. Students will be capable of developing proper interdisciplinary connections between the areas of telecommunication networks, micro-opto-electronics, and systems design. They will acquire theoretical and practical design skills for the operation and maintenance of network systems and device fabrication. Regarding photonic integration, the exposure to different fabrication facilities will allow students to understand both the different technologic steps and the environment in which production platforms of integrated devices are standardized.

This page was last modified on 14 Feb. 2018